| 摘要 |
<p>PURPOSE:To increase the number of external electrodes and to easily realize many terminals by a method wherein the cross section at the bottom part of a package main body is formed to be step-shaped, the central part in the width direction of the package main body protrudes downward and the external electrodes are arranged and installed respectively in individual step parts. CONSTITUTION:A package main body 12 is formed by laminating three ceramic sheets 15 to 17; a recessed part for semiconductor-element mounting use is formed on the inside; and the cross section in the bottom part is formed to be step-shaped. The central part in the width direction of the package main body 12 protrudes downward; and recessed-part side electrodes 15a to 17a connected to a semiconductor element 13 via wires 18 are formed respectively in parts revealed on the inside of the package main body 12 on the surface of the individual ceramic sheets 15, 17. The inside face of an opening part 21a of a multilayer substrate 21 is formed in such a way that the cross section is step-shaped so as to correspond to the outside face of the package main body 12. Electrodes to which metal terminals 19 of the package main body are connected are formed in individual step parts. Thereby, the number of mounting faces of external electrodes can be increased by the number of step parts at the package main body 12.</p> |
