| 摘要 |
PURPOSE:To realize a thin shape as compared with conventional cases by a method wherein a bonding wire is wire-bonded while its wire loop height is made low and an inner lead is resin-sealed while its tip part is raised upward. CONSTITUTION:Bonding wires 1 between inner leads 2 of a flat lead frame and a chip 1 are wire-bonded while their loop height is made low. Then, the wire-bonded lead frame is resin-sealed in a state that tip parts of the inner leads 2 have been raised upward until sufficient insulation is ensured among the wires 1, the chip 3 and a tab 4 by using a metal mold provided with a taper used to raise only the tip parts of the inner leads 2 at inner lead holding parts 5 constituting one part of the metal mold for sealing use. At a sealing operation, the lead frame is clamped by using the metal mold. As a result, the tip parts of the inner leads 2 are raised upward by the taper of the metal mold, and a loop is corrected from its initial state. |
