| 摘要 |
PURPOSE:To lower the socket pitch thereby enabling a system to be highly integrated and light-weighted by a method wherein the title thin type memory module is provided with the substrate inserted into a socket mounted on a mother board and a semiconductor device mounted with a thin type package loaded on one surface or both surfaces of the substrate. CONSTITUTION:The title thin type memory module is provided with a substrate inserted into a socket mounted on a mother board and the semiconductor device with the thin type package loaded on one surface or both surfaces of the substrate. Besides, said module is provided with said substrate and the semiconductor device mounted with the thin type small outline package loaded on one surface or both surfaces of the substrate. In such a constitution, since the thin type package is loaded on one surface or both surfaces of the substrate, the thickness of the memory module can be made thinner than that of the conventional ones while enabling the socket pitch P to be lowered. |
