首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SOLDERING IMPLEMENT
摘要
申请公布号
JPH04130793(A)
申请公布日期
1992.05.01
申请号
JP19900252608
申请日期
1990.09.21
申请人
NEC CORP
发明人
TETSU SENTARO
分类号
B23K3/00;H05K1/18;H05K3/34
主分类号
B23K3/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
ACCOMMODATING SEMI-PERSISTENT SCHEDULING IN HETEROGENEOUS NETWORKS WITH RESTRICTED SUBFRAME PATTERNS
THRUST REVERSER SYSTEM WITH TRANSLATING ROTATING CASCADE AND METHOD OF OPERATION
THRUST REVERSER SYSTEM WITH TRANSLATING ROTATING BLOCKER DOORS AND METHOD OF OPERATION
INTERNAL COMBUSTION ENGINE EMPLOYING AN ORBITING PLANETARY GEARING SYSTEM
METHODS FOR GLASS STRENGTHENING
RECEIVER AND METHOD FOR DECODING DATA PACKETS
ACOUSTIC WAVE BAND REJECT FILTER
POWER CONNECTOR ASSEMBLY HAVING AN ALIGNMENT BODY
SWITCHING DEVICE
X-RAY MACHINE
PLATE HEAT EXCHANGER HAVING SEALED CONSTRUCTION
PLASTIC CONTAINER AND METHOD
NATURAL COMPOUNDS FOR USE IN THE TREATMENT OF BETA-2 ADRENERGIC RECEPTOR RELATED DISEASES
SUBSTITUTED BENZTROPINE ANALOGS FOR TREATMENT OF DEMENTIA
COMBINATION THERAPY WITH VOLASERTIB
Connection system with drop-out protection for the extremities of a mannequin
IMAGE ERASING APPARATUS AND IMAGE ERASING METHOD
PROCESS OF PURIFICATION OF TEICOPLANIN
Container for dialysis
HIGH-FORCE ROBOTIC GRIPPER
