Currentless bath for chemical deposition of copper@ (alloy) - contains polyethyleneimine deriv. and is formaldehyde-free

摘要

An aq. HCOH-free, currentless bath for the chemical deposition of Cu (alloys) contains a polyethyleneimine H2N-((CH2)n-NH)xH, esp. Q2N-((CH2)n-NQ)xQ. In the formulae n is 2,3 or 4; x is 30-1, 500; each Q is independently H, Me, Et, propyl or butyl. ADVANTAGE - The bath requires little supervision; an environmentally friendly reducing agent is used; the bath operates in the acid or neutral region; better quality Cu coatings than with known baths are obtd.