发明名称 APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENT
摘要 The present invention consists in that printed patterns on a printed circuit board and component information near the printed patterns are photographed, that the type of an electronic component to be mounted and the mounting position and mounting attitude of the electronic component are recognized from the photographed image, and that the predetermined electronic component is mounted on the predetermined position of the printed circuit board at the predetermined attitude on the basis of the above information items. Further, a program for the mounting order of all the electronic components to be mounted on the printed circuit board is generated on the basis of the image processing information items.
申请公布号 KR920003404(B1) 申请公布日期 1992.04.30
申请号 KR19890019173 申请日期 1989.12.21
申请人 HITACHI, LTD. 发明人 IDAGAKI, MASATO;HAEDA, YOSHIO;HUJISHIRO, GEISUKE;NAKAYAMA, SUSUMU
分类号 B23P21/00;B23P19/00;G06T1/00;H05K13/00;H05K13/08;(IPC1-7):H05K13/04 主分类号 B23P21/00
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