Tape automated bonding interconnect device mfr.

摘要

The interconnect device has at least three layers of circuitry, one for signal transmission and two for voltage planes (power and ground). The interconnect device is made by a processing on a stainless steel carrier plate. Laser drilling is used to define interconnect vias between signal and voltage (power and ground) plane layers. The TAB circuit is made in a manufacturing process by which a number of TAB circuits are formed simultaneously in a sheet on a backer or support structure. The individual TAB circuits are singulated by excising from the sheet at the end of the manufacturing process.