METHOD AND DEVICE FOR SUPER PRECISION POLISHING OF WAFER

摘要

PURPOSE:To eliminate the taper error of a wafer by keeping the other end face of the wafer and the surface plate surface in parallel at all times with the pressure of a polishing liquid discharged from a discharging part being applied on a pressure receiving face. CONSTITUTION:A flange 6 surrounding the outer peripheral face of a wafer 4 is formed on a holding member 3, and a pressure receiving face 8 which is parallel to the other end face of the wafer 4 and which retreats larger than the polishing allowance of the wafer from the wafer end face prior to polishing to the other end face side is formed on the end face side opposed to the surface plate surface la of this flange 6. Then plural discharging parts 9 discharging a polishing liquid are formed along the peripheral direction on this pressure receiving face 8, and the polishing of the wafer 4 is performed while discharging the polishing liquid toward the surface plate surface la from these discharging parts 9.