发明名称 LEAD FRAME FOR SINGLE INLINE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable to use the manufacturing equipment of a dual inline type and to reduce labor and cost by a method wherein the pitch of subject lead frame is synchronized to that of the dual in-line type and to unnecessitate the side, where outer lead terminal of a resin sealed section is not formed, is regarded as an unnecessary section to be removed. CONSTITUTION:The interval of the resin sealing section 2 on a lead frame 10 is made into a pitch (a) which is same as the dual inline type. In the interior of the sealed section 2, an element mounted pad 6 and an interior lead 5 are provided, and an exterior lead terminal 3 is formed on one side of the sealed section 2. The exterior lead terminal 3 is cut at l-l' and other dotted line section. Accordingly, the side where no lead terminal 3 of the sealed section 2 is provided, the section almost equal to the length of the lead terminal 3 becomes an unnecessary section to be removed. Thus, the pitch between the sealed section 2's is enlarged so as to be equal to the dual inline type and the manufacturing equipment such as molding mold, a bonder and the like can be commonly used, thereby enabling to reduce the labor and the cost especially in the case when the device is manufactured in small quantity.
申请公布号 JPS56158462(A) 申请公布日期 1981.12.07
申请号 JP19800061661 申请日期 1980.05.12
申请人 发明人
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
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