| 摘要 |
PURPOSE:To test IC with high speed and high reliability in a state of wafer without hand work by increasing signals between a tester and a prober to provide the tester itself with the function of program changing treatment. CONSTITUTION:The exective order of test program by kinds of a device on a wafer is manually specified. Matching the wafer 1 by starting the program of the first kind is loaded for testing. The signals of finished test are put out to a prober 4 for treatment receiving said signals to turn to the next chip. Judging whether the test is finished or not, the test is continued loading up a program for a new line by the line changing signals 13. Judging whether the test of the whole chips is finished or not and in case it is not finished the matching work is resumed through the wafer end signals 14 while in case it is finished the test is ended. |
