| 摘要 |
PURPOSE:To mechanically reinforce a solder connected section and, especially, to prevent the occurrence of insufficient connection when the connected section is mechanically reinforced by connecting a multilayered substrate mounted with electronic components with a pin grid array substrate on which lead pins are arranged with solder and fully or partially filling the space between both substrates. CONSTITUTION:A semiconductor element 6, chip components 9, mini-mold component 10, etc., are mounted on a multilayered substrate 1 using glass epoxy, ceramic material, etc., as a base material. Lead pins 4 are regularly arranged on the substrate 2 in advance and pad electrode groups formed on the substrates 1 and 2 are connected with solder. The space between the two substrates l and 2 where the solder connecting sections exist is filled with a resin so as to seal and mechanically reinforce the connecting sections. |
