| 摘要 |
PURPOSE:To make a characteristic impedance definite up to a part immediately in front of outer electrodes on a board to be mounted by a method wherein outer leads for lead interconnections and parts near outer leads for intermediate leads supported by a resin film are set to the same height as the outer electrodes connected to a semiconductor device. CONSTITUTION:Metal-foil interconnection leads 5 formed on a film 7 are extended to inner leads 2 at an opening part 11 on which a chip 1 such as, e.g. a GaAs integrated circuit or the like is mounted; they are connected to pads on the chip 1 at the parts. The interconnection leads 5 are provided with outer leads 4 as external connecting terminals. A resin mold 9 does not cover the whole part of the film 7; a film region 3 provided with transmission lines near the outer leads are not covered and are revealed to the outside. The film is shaped to be an S-shape from one part near the region and is kept at the same height as external electrodes of a board, on which a semiconductor device is mounted, from the part up to the outer leads 4. |
