Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it

摘要

A copolymer blend of epoxy and polyimide is used as a dielectric layer in a multilayer interconnect structure. This copolymer blend is free of cracking and crazing, provides good interlayer adhesion and following fabrication, is stable at temperatures in excess of 200 DEG C. A preferred composition is a siloxane polyimide in combination with a cycloalaphatic epoxy.