| 摘要 |
PURPOSE:To reduce the noise produced when a circuit is operated so as to prevent insufficient operations of the circuit by sealing a semiconductor pellet, wires, and leads with a resin containing powder of a ferromagnetic substance after the leads are connected to the external terminals of the pellet through the wires. CONSTITUTION:In this resin-sealed semiconductor device 1 adopting a DILP structure, a semiconductor pellet 4 mounted on a tab 2A is sealed with a resin 6. The resin 6 also seals bonding wires 5 and inner leads 2C. Powder of a ferromagnetic substance is scattered in the resin 6 at a fixed rate and fixed in the vicinity of the peripheries of the wires 5 and inner leads 2C. The powder of the ferromagnetic substance confined in the resin 6 generates an electromagnetic force which acts in the direction in which magnetic fields produced by transient currents flowing to each parasitic inductance of the wires 5 and leads 2C are canceled and reduces the occurrence of noise. |
