发明名称 MULTILAYER WIRING BOARD
摘要 PURPOSE:To make a strip line stable in propagation characteristics by a method wherein a power source ground pattern and a signal line pattern are made to overlap each other forming a certain angle with each other, and the patterns are kept constant in an overlap area rate. CONSTITUTION:A power source ground pattern 1 is provided making an angle alphaof 45 deg. with a signal line 3, the lateral side (a) and the longitudinal side (b) of the pattern 1 are equal to each other, and the width (c) of the pattern 1 and the length (a) of the side of the pattern 1 are so set as to satisfy a formula, 0<c<b/2. When the width (d) of a clearance 2, the width (c) of the pattern 1, and the length (b) of the pattern 1 are set to satisfy a formula, d=b-2c, and the overlap area rate of the GND pattern 1 with the signal line pattern 3 is constant and as much as 2c/b of the total area of the signal line pattern 3 independent of the width and the position of the signal line pattern 3. Even in case of a signal line 4, the same result can be obtained. Therefore, the signal lines 3 and 4 can be lessened in dispersion of distributed capacity, and a multilayer wiring board of this design can be made stable in characteristic impedance and propagation delay time independent of the width and the position of the signal line patterns.
申请公布号 JPH04127598(A) 申请公布日期 1992.04.28
申请号 JP19900249811 申请日期 1990.09.19
申请人 NEC CORP 发明人 SASAKI AKIHIRO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利