摘要 |
PURPOSE:To precisely inspect the sectional shape of a resist pattern, without breaking a substrate, by a method wherein a punched-out test pattern after lithography is inclined, and, in this state, the section of a resist pattern is exposed and inspected. CONSTITUTION:A convex type punched-out test pattern composed of a pattern part 13 for managing dimension and a rectangular pattern part 14 whose width and depth in contact with the end portion of the pattern part 13 are, e.g. 10mum, in which test pattern proximity effect to an electron beam is taken into account is subjected to lithography irradiation of a resist pattern by an ordinary substrate resist forming process. In the state that the punched-out test pattern in a resist pattern 17 subjected to lithography in the above manner is inclined, the pattern part 13 for managing dimension is observed from the rectangular pattern part 14 side, and a resist pattern section 15 is exposed to a substrate surface 16 and inspected. Thereby the sectional shape of the resist pattern can be highly precisely inspected without breaking the substrate. |