| 摘要 |
PURPOSE:To improve the joining strength between pins and a multilayered ceramic substrate by forming a gold via conductor which is larger than the diameter of each pin and has a strong joining property against the pin below each pin erected on a green sheet and simultaneously sintering the green sheet, pins, and gold via conductors. CONSTITUTION:Rod-like pins 12 are erected at prescribed locations on a green sheet constituted of a glass ceramic material for low temperature sintering. Then a gold via conductor 14 having a strong joining property against the pins 12 is formed below each pin 12 and the green sheet, pins, and conductors 14 are simultaneously sintered. Each conductor 14 has a size larger than the diameter of each pin 12. Therefore, a decline in joining strength between the pins and this ceramic substrate caused by clearances produced between the pins and substrate can be prevented. |
