发明名称 LIGHT ELEMENT MODULE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable simple loading to a printed wiring board and impedance control by providing a plurality of striped electrodes which protrude by the predetermined length from the insulated area at the side surface of package in the same direction as the approaching direction of an insulated substrate and supplying the power to a light element in the package and to the peripheral parts thereof. CONSTITUTION:A square type package 1 and an optical fiber 2 are fixed by a fiber holder 3, a heat sink 5 is formed on the rear side of the package 1 and elements are comprised within the package 1. Sealing and electrical insulation are realized by providing an insulating material using alumina on the side of bottom surface of the side surfaces of the package 1 and electrodes are wired in the package 1 through this insulation area 8. An insulating plate 6 using alumina is approached from both side surfaces of the package 1 in perpendicular to the insulating area 8 and a striped electrode 7 is formed on the upper surface of this insulating plate 6. The striped electrode 7 is connected with the electrode guided from the package 1 through the insulating area 8 on the side surfaces of the package a. The end part of striped electrode 7 is located in the side section of the insulating plate 6.
申请公布号 JPH04124891(A) 申请公布日期 1992.04.24
申请号 JP19900245474 申请日期 1990.09.14
申请人 TOSHIBA CORP 发明人 CHINEN YUKIO
分类号 G02B6/42;H01L23/36;H01L33/58;H01S5/00 主分类号 G02B6/42
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