发明名称 WIRING STRUCTURE FOR FLOOR FACE
摘要 PURPOSE:To enhance following property to uneven surface of floor by a method in which the holes of a cover panel, larger than the inner diameter of step portion on the upper end periphery of strut and smaller than the upper end diameter of the strut, are fitted on the upper stage steps of the strut of a wiring panel. CONSTITUTION:Main struts 1a whose lower ends are connected by beams in a lattice form and wiring panels A having auxiliary struts 1b are placed on a floor, and electric wires 6 are set between the struts 1a and 1b. The holes 41a and 41b of a cover panel 4 are loosely fitted through a gap (e) onto the upper end steps 3a and 3b of the struts 1a and 1b on the panel A, and a highlyrigid cover panel 4 is placed on the wiring panel. The following property to uneven surfaces can thus be enhanced.
申请公布号 JPH04124365(A) 申请公布日期 1992.04.24
申请号 JP19900245154 申请日期 1990.09.13
申请人 NITTO DENKO CORP;RAION JIMUKI:KK;TAKU KENCHIKU KOUZOU SETSUKEI:KK 发明人 NISHIMURA TAKAMASA;MAMIYA NOBUO;SAITO KIYOSHI;ATOOKA KENJI;NAITO SHUNICHI
分类号 E04F15/024;E04F15/18;H02G3/30 主分类号 E04F15/024
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