| 摘要 |
PURPOSE:To obtain a hybrid multilayer circuit wiring board having excellent contactness between a ceramic substrate and a resin base layer by forming a ceramic metallized layer on the surface of a ceramic substrate in the side being in contact with a resin substrate and bonding the resin substrate. CONSTITUTION:An alumina is metallized to a single surface of alumina layer plate 4 to form an alumina metallized layer using a plasma metallizing apparatus. Next, two sheets of polyimide resin prepreg using glass cloth as a base material are placed on the obtained alumina metallized layer and an electrolytic copper foil is further placed thereon. Finally, this copper foil is thermally molded for the bonding purpose. |
