发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To sufficiently secure a wiring space of leads by partly covering the intermediate part of an inner part of the lead with a silver-plated film, and bonding one end of the wire to the film. CONSTITUTION:The upper surface of the end of each inner part 9a is partly covered with a silver-plated film 10a to improve bondability of wire bonding, and the intermediate part of a shared inner lead 9c is also partly covered with a silver-plated film 10b. First and second pellets 11, 12 are disposed adjacently on both tabs 6A, 6B, bonded by adhesive material layer 14, and electrode pads of the pellets 6A, 6B are wire bonded to the inner parts 9a, 19c of a lead 9 at a unit lead 2.</p>
申请公布号 JPH04124866(A) 申请公布日期 1992.04.24
申请号 JP19900243959 申请日期 1990.09.17
申请人 HITACHI LTD;AKITA DENSHI KK 发明人 SHIMIZU KAZUO;TAKAHASHI TOSHIHARU
分类号 H01L25/18;H01L21/60;H01L23/50;H01L25/04 主分类号 H01L25/18
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