| 摘要 |
<p>PURPOSE:To suppress generation of cracks in a conductive adhesive stuck area by integrally forming a metal thin film under the condition that the film enters the surface of a hole or cutout part from an external surface of a ceramics substrate and fixing the end portions of metal lead wires to the ceramics substrate with a conductive adhesive filling the hole or cutout part. CONSTITUTION:In a thin film resistor 12, a lead wire 18 is connected, through a conductive adhesive 22, for a resistance body thin film area 20a located on the surface within a cutout part 16 of a ceramics substrate 14, but conductive bonding agent 22 fills only the cutout part 16 and does no reach the external surface of the ceramics substrate 14. Thereby, increase of thickness as the resistance body can be avoided and moreover, during at the time of handling during production and during use, if various forces are applied to the lead wire 18, generation of cracks or deformation can be prevented because the conductive bonding agent 22 for fixing the lead wires 18 to the ceramics substrate 14 is reinforced by the cutout part 15 of the ceramics plate 14.</p> |
