| 摘要 |
<p>PURPOSE:To realize a small size, highly densely fabricated, and light weight electronic device by exposing part of input/output terminals molded integrally with a case to positions facing electrodes on a circuit board and by electrically connecting that part of the input/output terminals to the electrodes on the circuit board via inner leads. CONSTITUTION:Input/output terminals 2 and 3 are integrally molded when molding case 4, and in the section being connected with inner lead 6 the length of the input/ output terminal is set so that the connecting section is exposed at the position facing the electrodes of circuit board 1. Inner lead 6 is connected to input/output terminals 2 and 3, respectively, the connecting section of circuit board 1 touches conductive electrode 9 in the tapered portion the tip of inner lead 6, and they are connected to each other by filling the connecting section with conductive member 7. Since the shape of input/output terminal 2 is changed so as to be corresponding to the position of electrode 9, the circuit, loaded electronic parts, and electrode 9 can be laid out freely. Furthermore, since the connection between electrode 9 on circuit board 1 and inner lead 6 can be made vertically, it is not necessary to prepare space for connection in the periphery of circuit board 1, thereby being able to make the electronic device compact.</p> |
