CHIP-TYPE SOLID ELECTROLYTIC CAPACITOR

摘要

PURPOSE:To obtain high-capacitance chip-type solid electrolytic capacitors suitable for low impedance in a high-frequency range by mold encapsulation in a rectangular parallelopiped so that a pair of the anode and cathode of four external connection terminals are exposed out of the encapsulation face. CONSTITUTION:A mold encapsulant 21 is formed of epoxy resin in a rectangular parallelopiped so that a pair of the anode and cathode of four external connection terminals 20 are exposed out of separate encapsulation faces. Thereafter, the external connection terminals 20 are solder-plated by dipping in a solder bath and bent from their exposed faces along the surface of the mold encapsulant 21, whereby free packaging can be made in either way vertically or laterally in accordance with packaging space. In addition, inductance can be minimized by utmost utilization of the capacitance of a capacitor.