DEVICE FOR CLASSIFYING THICKNESS OF WAFER AND METHOD FOR TAKING OUT WAFER HELD BEING PILED TOGETHER

摘要

PURPOSE:To classify wafers by thickness so as to improve work efficiency by providing constitution of a wafer holding mechanism, wafer position measuring device, turning, vertical motion, extension and contraction possible conveying arm, thickness measuring device of the wafer, storing cassette and a control unit. CONSTITUTION:A wafer group 5, tried to separate, is mounted onto a mounting bed 2 of a wafer holding mechanism 1, and a door 7 is closed. A lower end 9 of a wafer position measuring device 3 is lowered down to a predetermined position X simultaneously raising the mounting bed 2, and when indication of the position measuring device 3 obtains a preset value, the position measuring device 3 is retracted upward by stopping the holding mechanism 1 to suck a wafer to a point end sucker part 11 by extension-lowering a wafer conveying arm 10. The wafer conveying arm 10 is turned, and the wafer is conveyed onto a measuring table 13, released from sucking and retracted. A wafer thickness measuring device 4 is lowered down to obtain a thickness, and the result is fed to a computer 15. The thickness measuring device 4 is lifted and retracted, and the wafer 8 is sucked by the wafer conveying arm 10, turned to a storage cassette 16, determined corresponding to the measured thickness of the wafer, and stored.