发明名称 |
Transistor structure with reduced collector-to-substrate capacitance. |
摘要 |
<p>A pre-processed substrate structure 71 for a semiconductor device. A subcollector layer 23 is spaced apart from a substrate 21 by a dielectric 25. A relatively small, lightly-doped epitaxial feed-through layer 29 extends through the dielectric between the substrate and the subcollector. A transistor constructed over the subcollector has very low collector-to-substrate capacitance. A plurality of devices on a common substrate are electrically isolated from each other by channel stops formed in the substrate around each device. <IMAGE></p> |
申请公布号 |
EP0481202(A1) |
申请公布日期 |
1992.04.22 |
申请号 |
EP19910114676 |
申请日期 |
1991.08.30 |
申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
CHIANG, SHANG-YI;KAMINS, THEODORE I. |
分类号 |
H01L29/205;H01L21/331;H01L29/08;H01L29/73;H01L29/732;H01L29/737 |
主分类号 |
H01L29/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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