发明名称 Transistor structure with reduced collector-to-substrate capacitance.
摘要 <p>A pre-processed substrate structure 71 for a semiconductor device. A subcollector layer 23 is spaced apart from a substrate 21 by a dielectric 25. A relatively small, lightly-doped epitaxial feed-through layer 29 extends through the dielectric between the substrate and the subcollector. A transistor constructed over the subcollector has very low collector-to-substrate capacitance. A plurality of devices on a common substrate are electrically isolated from each other by channel stops formed in the substrate around each device. &lt;IMAGE&gt;</p>
申请公布号 EP0481202(A1) 申请公布日期 1992.04.22
申请号 EP19910114676 申请日期 1991.08.30
申请人 HEWLETT-PACKARD COMPANY 发明人 CHIANG, SHANG-YI;KAMINS, THEODORE I.
分类号 H01L29/205;H01L21/331;H01L29/08;H01L29/73;H01L29/732;H01L29/737 主分类号 H01L29/205
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