发明名称 EYELET FOR REINFORCEMENT OF SOLDERING STRENGTH
摘要 PURPOSE:To ensure the soldering strength of a printed wiring board to improve the reliability of soldering by forming a swelling portion which projects in the external direction and buts against a fixing hole on the cylinder of an eyelet. CONSTITUTION:An eyelet 1 is fixed to a fixing hole 9 of a printed wiring board 6 and the fixing hole 9 abuts against the swelling portion 5 of the eyelet 1. The eyelet 1 is fixed to the printed wiring board 6 by calking the lower end portion of a cylinder portion 3. Further, a part lead 10 is inserted into the lead inserting through hole 2 of the eyelet, and soldered to be fixed to the eyelet 1, etc. Under this condition, the clearance to the fixing hole 9 of the printed wiring board 6 is almost eliminated, and soldering is formed inside the lead inserting through hole 2 and inside the swelling portion 5.
申请公布号 JPH04121977(A) 申请公布日期 1992.04.22
申请号 JP19900239888 申请日期 1990.09.12
申请人 TOSHIBA CORP 发明人 TAKAHASHI KIICHI
分类号 H05K1/18;H05K3/34 主分类号 H05K1/18
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