| 摘要 |
A method for arranging components to be mounted on circuit packs to achieve improved cooling is disclosed. In accordance with one aspect of the invention, components are arranged such that the longer dimension of each component is substantially parallel to the flow of a heat carrier as it streams from an inlet to an outlet. In accordance with another aspect of the invention, those components having larger aspect ratios are substantially placed near the outlet via which the heat carrier is removed.
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