发明名称 |
Process for multilayer printed circuit board manufacture |
摘要 |
Process for at least partially dissolving a copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds. When used in the manufacture of a multilayer printed circuit board, the process improves adhesion between board layers, reduces or eliminates localized delamination of a multilayer board that occurs during through-hole drilling, and eliminates or substantially reduces the occurrence of pink ring.
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申请公布号 |
US5106454(A) |
申请公布日期 |
1992.04.21 |
申请号 |
US19900607548 |
申请日期 |
1990.11.01 |
申请人 |
SHIPLEY COMPANY INC. |
发明人 |
ALLARDYCE, GEORGE R.;DAVIES, ANTHONY J.;WAYNESS, DAVID J.;SINGH, AMRIK |
分类号 |
H05K3/38;H05K3/46 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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