COMPOSITE INTEGRATED CIRCUITS INCLUDING SEMICONDUCTOR CHIPS MOUNTED ON A COMMON SUBSTRATE WITH CONNECTIONS MADE THROUGH A DIELECTRIC ENCAPSULATOR

摘要

Integrated circuits in which individual semiconductor chips, exhibiting diverse electrical and compositional characteristics, may in combination with thin or thick film passive components be applied to a single supporting electric substrate. The chips and conductive patterns deposited on the substrate being encapsulated in a dielectric material, with electrical connections made to said chips and conductive patterns through openings formed in said dielectric layer.