发明名称 |
High-density, multi-level interconnects, flex circuits, and tape for tab |
摘要 |
A multi-layer interconnect structure of alternating dielectric (e.g., polyimide) and metal (e.g., copper) is built on a substrate supporting a continuous layer of metal. This metal layer is used as an electrode for plating vias through all the dielectric layers. Once the desired number of layers are formed, the substrate is removed and the continuous metal layer is patterned. Solid metal vias having nearly vertical side walls can be stacked vertically, producing good electrical and thermal transfer paths and permitting small, closely-spaced conductors. Further, by mixing geometrical shapes of conductors, a variety of useful structures can be achieved, such as controlled impedance transmission lines and multiconductor TAB tape with interconnects on tape of different dimensions than TAB fingers.
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申请公布号 |
US5106461(A) |
申请公布日期 |
1992.04.21 |
申请号 |
US19900632364 |
申请日期 |
1990.12.21 |
申请人 |
MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
发明人 |
VOLFSON, DAVID;SENTURIA, STEPHEN D. |
分类号 |
H01L23/538;H05K3/00;H05K3/06;H05K3/10;H05K3/20;H05K3/38;H05K3/42;H05K3/46 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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