发明名称 SHORT-CIRCUITING PREVENTION STRUCTURE OF IC PACKAGING SUBSTRATE
摘要 PURPOSE:To prevent a lead wire from contacting a terminal of a substrate surface or other lead wires electrically by providing a protruding part at proper locations on the substrate between the substrate and the IC terminal and then supporting the lead wire at the protruding part. CONSTITUTION:A protruding part 2 consists of an insulator and is placed in parallel between terminals which are placed alternately in zigzag on a substrate. Also, the protruding part 2 which consists of the insulator may be formed in one piece with the substrate or may be sealed by using means such as an adhesion material after forming a terminal. Even if the lead wire 4 is deformed and contacts the substrate by forming the protruding part 2, the lead wire 4 is supported by the protruding part 2, thus preventing the terminal and the lead wire 4 for purposes other than the substrate itself from contacting each other.
申请公布号 JPH04120745(A) 申请公布日期 1992.04.21
申请号 JP19900241873 申请日期 1990.09.12
申请人 SEIKO INSTR INC 发明人 SUZUKI HIROKAZU
分类号 H01L21/60 主分类号 H01L21/60
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