发明名称 WIRE-BONDING DEVICE
摘要 PURPOSE:To enable proper treatment even if a shape of a lead frame is changed by forming a capacitor of an electrode within a heater plate and the lead frame for allowing the lead frame to be attracted and fixed to the heater plate. CONSTITUTION:When a lead frame 3 is set to a heater plate 1, a high voltage is applied to an electrode 10 and the lead frame 3 by an amplifier 40. Then, the heater plate 1 and the lead frame 3 attract each other due to electrostatic induction so that the lead frame 3 can be fixed to the heater plate 1. In this case, the lead frame 3 is installed on the ground, thus preventing electrical damage due to a high voltage. When carrying the lead frame 3, electric change which is charged between the heater plate 1 and the lead frame 3 is discharged by the amplifier 40 and the attraction force between the heater plate 1 and the lead frame 3 is eliminated before transportation. An upper surface of the heater plate 1 may be flat or a fine pin-shaped protruding 31 may be formed, thus enabling air which stagnates between the lead frame 3 and the heater plate 1 to be reduced.
申请公布号 JPH04120747(A) 申请公布日期 1992.04.21
申请号 JP19900242165 申请日期 1990.09.12
申请人 NEC CORP 发明人 MATSUMOTO ITARU
分类号 H01L21/60 主分类号 H01L21/60
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