发明名称 |
Multi-lead hermetic power package with high packing density |
摘要 |
An hermetic package for power semiconductor devices is disclosed. The package includes a generally rectangular cavity with leads extending through the walls thereof. The bottom of the cavity is defined by a base which includes a pair of mounting tabs protruding from opposite corners thereof. The mounting tabs are configured to allow the packages to be nested together. A cover attached to the walls provides a hermetically sealed package.
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申请公布号 |
US5107074(A) |
申请公布日期 |
1992.04.21 |
申请号 |
US19900516506 |
申请日期 |
1990.04.30 |
申请人 |
IXYS CORPORATION |
发明人 |
NOLL, WALTER;HERON, CHUCK |
分类号 |
H01L23/047 |
主分类号 |
H01L23/047 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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