| 摘要 |
PURPOSE:To simplify the processes ranging from an IC chip to a mounting substrate, to make possible an increase in the uniformity of the processes for connecting many electrodes at once and to improve the reliability of connection by a method wherein conductors for connection use are formed on a filmlike transfer material base having flexibility and these conductors for connection use are pressed and heated and are connected. CONSTITUTION:An IC chip 1 is fixed on a mounting substrate 4 via a heat dissipation layer 6. Bumps 5 for connection use respectively exist on each electrode on the chip 1, bumps 5 respectively exist also on each end part of a wiring layer 3 on the substrate 4 and connection terminals are formed on the substrate 4. A transfer material base 7 and conductors 2 for connection use are faced downward over the chip and the connection terminals, are made to oppose to the chip 1 and the connection terminals to set the position of a transfer material, a press body 8, which is provided with a built-in heating heater and can be subjected to temperature control, is made to descend and a heating and pressing process is performed. Whereupon, the bumps 5 are melted with heat, are jointed with the conductors 2 for connection use and at the same time, the conductors 2 are peeled from the base 7. The electrodes on the chip 1 and the connection terminals on the substrate 4 are electrically connected to each other through the conductors 2 for connection use. |
