发明名称 MANUFACTURE OF LAMINATED ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To obtain a manufacture of laminated electronic components whose green sheets do not slide horizontally upon pressurization and which are free of deviation from designed values such as electrostatic capacitance values or of dispersion in the values by using a flat plate having at least two projections in the peripheral region of a face on the green sheet to be compression-bonded at relative positions suitable to fix the green sheet. CONSTITUTION:Green sheets 1 punched out in a regular shape are printed with two kinds A, B of internal electrode conductor patterns 2 and 3. Next, A, B kinds of printed sheets are superposed with unprinted sheets C. A flat plate 4a having small truncated-cone projections 6 at four points is mounted on a pile of green sheets 1, which are thermocompression bonded by pressurization with this plate and the lower flat plate 5. This method allows previous compression bonding of a green sheet part pressed by projections to strengthen adhesion between sheets of this part and to make a part of green sheets unsusceptible to slide, thereby providing a compression bonded body showing less horizontal slide as the whole of green sheets in a state that sheets are stopped from moving.</p>
申请公布号 JPH04120714(A) 申请公布日期 1992.04.21
申请号 JP19900241710 申请日期 1990.09.12
申请人 TAIYO YUDEN CO LTD 发明人 HOSHI KENICHI
分类号 B32B37/10;B28B11/02;H01G4/30 主分类号 B32B37/10
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