| 摘要 |
<p>PURPOSE:To apparently double the lead pitch on the bonded surface of a lead frame from the conventional lead frame so as to increase the number of terminals by constituting the lead frame of an upper and lower lead frames and connecting the upper and lower lead frames with each other zigzag while they are electrically insulated from each other with an insulating material. CONSTITUTION:A semiconductor integrated circuit 2 is connected with a lower and upper lead frames 1 and 7 through bonding wires 3 and 4 and sealed with a sealing material of resin, etc. Since the lower lead frame 1 is electrically insulated from the upper lead frame 7 by means of an insulating material 5, they are not electrically connected to each other. Therefore, no larger-sized expensive lead frame is required and the package can be miniaturized even when the number of input-output terminals of the circuit 2 increases, since the same lead frame can be used for wire bonding without changing its size.</p> |
