| 摘要 |
<p>PURPOSE:To improve yield at the time of manufacturing a board and to respond to a request for a high speed by laminating a film circuit board having a signal wiring layer and a through hole in which I/O pins of an electronic component are inserted to be disposed, and connecting the component with solder supplied to the hole. CONSTITUTION:A film circuit board 7 to be provided on a ceramic board 2 is formed with a ground layer 14 impedance-matched to a central layer through a polyimide insulating layer 17, signal wiring patterns 19 are arranged on the front and rear surfaces, wiring channel transfer vias 16 are provided at suitable positions to be connected between the layers. Further, through holes 6 for inserting pins coincident with I/O pins 5 of a semiconductor element 1 to be placed are formed. After the boards 7 are laminated with the pin 5 of the element 1 as a guide, a solder ring 22 is inserted to the pin 5, and simultaneously soldered 8. Thereafter, the pin 5 of the element 1 is simultaneously soldered to element connecting pad 12 of the board 2 to simultaneously mount the board 7 and the element 1.</p> |
