| 摘要 |
PURPOSE:To improve the accuracy of a die bonding position by positioning a mask which has the function of correcting the deviation of an optical semiconductor element when die bonding by means of reference holes provided at the positions close to the die bonding position on a lead frame. CONSTITUTION:Reference holes 18 are provided on a lead frame 10 at positions which do not cause troubles to the die bonding of an optical semiconductor and that are closest to a die bonding position B on a lead frame 10. Pins 20 for positioning a mask 19 which has the function of correcting the deviation of the optical semiconductor 11 when die bonding are inserted into the reference holes for positioning the mask and the element 11 is die bonded on the lead frame 10 from a guide hole 22 which is on the mask 19 and that guides the element 11 to the prescribed die bonding position B on the mask 19. Then, the mask 19 is removed from the lead frame 10 and the element 11 is resin sealed leaving the reference holes 18.
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