| 摘要 |
PURPOSE:To integrally mount extremely thin thin film semiconductor devices by surface-mounting one main surfaces of at least two thin film semiconductor devices each other. CONSTITUTION:One main surface of a first thin film semiconductor device 3 and one main surface of a second thin film semiconductor device 4 are surface-mounted on a ceramic board, etc. For example, power sources 1, 5 formed on the other main surface of the device 3, and a printed electrode 2 are surface-mounted, and electrodes 2, 6 formed on one main surface, and electrodes 3, 7 formed on one main surface of the device 4 are surface-mounted. Further, beam leads l, 9 formed on one main surface of the device 3 are connected to the electrode 2, also connected to beam leads 2, 10 formed on one main surface of the device 4, and the leads 2, 10 are also connected to the electrode 2. |
