| 摘要 |
<p>PURPOSE:To disperse the thermal strain of a resin at chip corner parts and to prevent the generation of a gap between a chip and the resin by a method wherein extension parts are respectively provided on the sides of the suspension leads of the island part of the lead fame of a semiconductor device. CONSTITUTION:An island part 5 of a lead frame 1 is provided with corner parts 10 of extension parts, whereby the shrinkage stress (the thermal strain) of a resin being concentrated on chip corner parts 11 and island corner parts 9 can be dispersed. Accordingly, the generation of the slide of Al or a passivation crack in a chip pattern, which is caused by the shrinkage stress of the resin, can be prevented, the disconnection between wires and pads due to the peeling of the resin from a chip, which is caused by the shrinkage stress of the resin, is eliminated, and as water content hardly intrudes, such an effect as the deterioration of the characteristics of a semiconductor device due to corrosion of the Al pads and the disconnection between the wires is eliminated can be obtained.</p> |
