| 摘要 |
PURPOSE:To obtain a printed circuit board, excellent in the resistance to deterioration of insulation and copper migration after moisture or water absorption treatment by sandwiching a prepreg impregnated with a specified epoxy resin varnish between metallic mirror surfaces and molding the assemblage under applied heat and pressure. CONSTITUTION:A process for producing a laminate by laminating one or more prepregs obtained by impregnating with an epoxy resin varnish, sandwiching the prepregs between metallic mirror surfaces and molding the assemblage under applied heat and pressure, wherein the varnish contains an epoxy resin comprising 50wt.% or above bisphenol A epoxy resin, 0.3-0.7 equivalent, per equivalent of the epoxy resin, of dicyandiamide and 1,8-diazabicyclo[5.4.0]- undecene as a curing catalyst. The obtained laminate is desirable as a printed circuit board which is processed and used under severe conditions. |
