| 摘要 |
<p>A polyacetal resin composition comprising (A) a polyacetal resin and (B) at least one compound selected among isocyanate compounds, isothiocyanate compounds and their modifications in an amount of 0.1 to 15 wt% of the whole composition, and having an improved bondability by a curing resin adhesive; and a part comprising a combination of a molding produced therefrom and the adhesive.</p> |
