| 摘要 |
PURPOSE:To entrain no foam between a work and plate, and to make the wax thickness highly uniform, by using a plate provided with one or plural holes or grooves at a work adhesion position, and solidifying a molten wax with its cooling from the work back face side, in case of solidifying it interposed between the work and plate. CONSTITUTION:More than one hole or groove 6 is provided at the sticking position of a work (e.g. wafer) 1 placed on the plate 2 surface to prevent the air entrainment between the work 1 and plate 2. Simultaneously, a wax 5 interposed between the work 1 and plate 2 is solidified with its cooling by a water cooling jacket 10 from the work 1 back face side. Thus no air is entrained between the work 1 and plate 2, also the wax 5 is solidified from the back face side of the work 1, so the work 1 back face is solidified holds a high parallelism with the plate 2 surface even after the wax solidification, and so a high working accuracy can be achieved, with the shapes of a hole and groove 6 being not transferred on the work 1 surface even after polishing. |
