| 摘要 |
PURPOSE:To prevent impurities from penetrating to inner elements, and to do without increasing assembly manhour, and further, to prevent contact failures from generating, by providing a second lead between a lead and a semiconductor element at distances from others, and by sticking a bonding wire in a pressing way on the second lead. CONSTITUTION:In a semiconductor device, a lead 1 and a semiconductor element 2 are connected by a bonding wire 3. Thereafter, the bonding wire 3 is stuck in a pressing way on a lead 4 for fastening the bonding wire 3, and the bonding wire 3 is fastened. |
