| 摘要 |
In an encapsulated semiconductor module (12) in which a semiconductor chip (14), having a major surface with terminals thereon, is deposed within the encapsulating material (19), a plurality of self-supporting, unitary, discrete, and continuous lead frame conductors (18) formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material, so that discrete wires (16) can be used to connect respective ones of said conductors to respective ones of said terminals. In the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel conductor to the desired terminal with a short wire. |
