| 摘要 |
<p>The present invention provides a process for forming a solder mask on an electric circuit board (3) without any defects. The process comprises forming an electric circuit on a substrate, coating a negative type photosensitive solder resist (2) on the obtained electric circuit board, and then exposing to light through a negative film (4) followed by developing, characterized in that the negative type photosensitive solder resist is electrodepositable and said coating of the solder resist is conducted by electrocoating the resist on an electroconductive transfer substrate (1) which is different from the electric circuit board and then transferring the coated film onto the electric circuit board (3).</p> |
