| 发明名称 |
ADHESIVE COMPOSITION AND INSULATING SUBSTRATE CLAD WITH THIS COMPOSITION USED FOR PRODUCING PRINTED-CIRCUIT BOARDS |
| 摘要 |
<p>An insulating substrate having a layer of an adhesive composition comprising (A) a modified phenolic resin and (B) acrylonitrile-butadiene rubber on at least one surface of a substrate is suitable for producing printed circuit boards having excellent solder heat resistance by an additive process.</p> |
| 申请公布号 |
EP0192365(B1) |
申请公布日期 |
1992.04.15 |
| 申请号 |
EP19860300640 |
申请日期 |
1986.01.30 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
TAKAHASHI, HIROSHI;MOROZUMI, NAOHIRO;TAKANEZAWA, SHIN;NAKAO, KIYOSHI |
| 分类号 |
C08G8/24;C08L7/00;C08L9/02;C08L21/00;C08L33/00;C08L33/02;C08L61/00;C08L61/04;C08L61/06;C08L61/10;C09J109/02;C09J121/00;C09J161/00;C09J161/06;C09J161/34;H05K3/18;H05K3/38 |
主分类号 |
C08G8/24 |
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