| 发明名称 |
A method for manufacturing plastics IC packages incorporating a heat sink. |
| 摘要 |
<p>In a method for manufacturing plastics packages for integrated circuits (2) incorporating a heat sink (8), the heat sink (8) is positioned on a mold (10) bottom (13) against which it is held pneumatically in fluid-tight relationship. <IMAGE></p> |
| 申请公布号 |
EP0480197(A1) |
申请公布日期 |
1992.04.15 |
| 申请号 |
EP19910115533 |
申请日期 |
1991.09.13 |
| 申请人 |
SGS-THOMSON MICROELECTRONICS S.R.L. |
发明人 |
MARCHISI, GUISEPPE;LAMOURELLE, FRANCOIS |
| 分类号 |
H01L21/56;H01L23/433 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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