POSITIVE PHOTORESIST COMPOSITION CONTAINING RADIATION SENSITIVE QUINONEDIAZIDE COMPOUND AND COMPLETELY ESTERIFIED POLYAMIC ACID POLYMER

摘要

The invention relates to positive working photoresists for producing relief structures of high-temperature resistant polyimide prepolymers, which photoresists can be developed in aqueous-alkaline medium and which contain, in an organic solvent, essentially at least a) one prepolymer which is convertible into a polyimide, b) one radiation-sensitive quinonediazide compound, and further optional components, said prepolymer being a completely esterified polyamic acid polymer.